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Mixed Signal Integration

As Essensium is a specialist SoC integrator covering analog and RF, we pay special attention to a careful integration of digital with analog and RF functions on the same silicon die.

Essensium has the expertise to ensure that a customer's mixed signal SoC ASIC works first time right by ensuring a series of key design measures, which are applied in a disciplined analog/digital integration flow.

    Essensium Mixed Signal Integration

    • Minimize Injection of Noise in Substrate

    • On chip decoupling of digital power supply
    • Slew rate controlled I/O cells
    • Package with exposed pads

    • Minimize Coupling of Noise in Analog/RF Circuitry

    • Physical separation of sensitive circuits from aggressor circuits
    • Use of isolation walls
    • Shielding of special signals with low impedance shields
    • Separation of power domains
    • On-chip voltage regulators with high PSRR

    • Minimize Impact on Sensitive Signals and Components

    • Fully differential design
    • Selective use of triple well and local guard rings
    • Shielding of sensitive passive components